hi-sincerity microelectronics corp. spec. no. : he6828 issued date : 1993.12.07 revised date : 2002.10.24 page no. : 1/3 HBC846 hsmc product specification HBC846 npn epitaxial planar transistor description the HBC846 is designed for switching and af amplifier amplification suitable for automatic insertion in thick and thin-film circuits. absolute maximum ratings ? maximum temperatures storage temperature .......................................................................................... -55 to +150 c junction temperature.................................................................................................... +150 c ? maximum power dissipation total power dissipation (ta=25 c) ............................................................................... 225 mw ? maximum voltages and currents (ta=25 c) vcbo collector to base voltage ......................................................................................... 80 v vceo collector to emitter voltage...................................................................................... 65 v vebo emitter to base voltage.............................................................................................. 6 v ic collector current ....................................................................................................... 10 0 ma characteristics (ta=25 c) symbol min. typ. max. unit test conditions bvcbo 80 - - v ic=100ua bvceo 65 - - v ic=1ma bvebo 6 - - v ie=10ua icbo - - 15 na vcb=30v *vce(sat)1 - 90 250 mv ic=10ma, ib=0.5ma *vce(sat)2 - 200 600 mv ic=100ma, ib=5ma *vbe(sat)1 - 700 - mv ic=10ma, ib=0.5ma *vbe(sat)2 - 900 - mv ic=100ma, ib=5ma vbe(on)1 580 - 700 mv vce=5v, ic=2ma vbe(on)2 - - 770 mv vce=5v, ic=10ma *hfe 110 - 800 vce=5v, ic=2ma ft - 300 - mhz vce=5v, ic=10ma cob - 3.5 6 pf vcb=10v, f=1mhz, ie=0 *pulse test: pulse width 380us, duty cycle 2% classification of hfe rank a b c hfe 110-220 200-450 420-800 sot-23
hi-sincerity microelectronics corp. spec. no. : he6828 issued date : 1993.12.07 revised date : 2002.10.24 page no. : 2/3 HBC846 hsmc product specification characteristics curve current gain & collector current 1 10 100 1000 0.1 1 10 100 1000 collector current (ma) hfe hfe @ v ce =5v on voltage & collector current 100 1000 10000 0.1 1 10 100 1000 collector current (ma) on voltage (mv) v be(on) @ v ce =5v capacitance & reverse-biased voltage 0.1 1 10 0.1 1 10 100 reverse-biased voltage (v) capacitance (pf) cob cutoff frequency & collector current 10 100 1000 1 10 100 collector current (ma) cutoff frequence (mhz) v ce =5v safe operating area 1 10 100 1000 10000 110100 forward voltage-v ce (v) collector current-i c (ma) pt=1ms pt=100ms pt=1s saturation voltage & collector current 10 100 1000 10000 100000 0.1 1 10 100 1000 collector current (ma) saturation voltage (mv) v ce( s at ) @ i c =20i b v be(sat) @ i c =20i b
hi-sincerity microelectronics corp. spec. no. : he6828 issued date : 1993.12.07 revised date : 2002.10.24 page no. : 3/3 HBC846 hsmc product specification sot-23 dimension *: typical inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.1102 0.1204 2.80 3.04 j 0.0034 0.0070 0.085 0.177 b 0.0472 0.0630 1.20 1.60 k 0.0128 0.0266 0.32 0.67 c 0.0335 0.0512 0.89 1.30 l 0.0335 0.0453 0.85 1.15 d 0.0118 0.0197 0.30 0.50 s 0.0830 0.1083 2.10 2.75 g 0.0669 0.0910 1.70 2.30 v 0.0098 0.0256 0.25 0.65 h 0.0005 0.0040 0.013 0.10 notes: 1.dimension and tolerance based on our spec. dated sep. 07,1997. 2.controlling dimension: millimeters. 3.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.if there is any question with packing specification or packing method, please contact your local hsmc sales office. material: ? lead: 42 alloy; solder plating ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of hsmc. ? hsmc reserves the right to make changes to its products without notice. ? hsmc semiconductor products are not warranted to be su itable for use in life-support applications, or systems. ? hsmc assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. head office and factory: ? head office (hi-sincerity microelectronics corp.): 10f.,no. 61, sec. 2, chung-shan n. rd. taipei taiwan r.o.c. tel: 886-2-25212056 fax: 886-2-25632712, 25368454 ? factory 1: no. 38, kuang fu s. rd., fu-kou hsin-chu industrial park hsin-chu taiwan. r.o.c tel: 886-3-5983621~5 fax: 886-3-5982931 h j k d a l g v c b 3 2 1 s style: pin 1.base 2.emitter 3.collector 3-lead sot-23 plastic surface mounted package hsmc package code: n marking: rank code 8 a control code
|
